Tongtai and Contrel Form Strategic Alliance at TPCA Show, Delivering Turnkey Electronics and Advanced Packaging Solutions
TAIPEI, Taiwan, October 26, 2025 — Tongtai Machine & Tool Co., Ltd. (4526.TW) and Contrel Technology Co., Ltd. (8064.TWO) jointly commenced their exhibition at the TPCA Show 2025 today. Under the central theme of "Lightweight Design, Precision, and Multi-Axis Machining," the two tech leaders unveiled their next-generation electronics manufacturing equipment and integrated application suites. The joint showcase spotlights server boards, advanced IC substrates, and revolutionary glass substrate processes, fully demonstrating Tongtai and Contrel's deep technological penetration and vertical integration capabilities across the electronics and semiconductor sectors, while highlighting the powerful synergy between mechanical machining and advanced laser processes.
As a long-standing pioneer in PCB drilling technology, Tongtai introduced two premier machine models engineered to meet the high-speed, high-precision demands of modern IC substrate manufacturing. Both systems integrate intelligent monitoring and automatic compensation technologies to maximize process stability and yield efficiency. The TDL-635 utilizes a lightweight platform design alongside a low-temperature-rise, high-speed spindle to deliver exceptional responsiveness and sub-micron positioning accuracy, effectively minimizing settling times. Meanwhile, the TCDM-620CL is purpose-built for high-precision blind and back-drilling processes, leveraging independent multi-axis control and CCD vision positioning to automatically compensate for panel expansion and contraction. This ensures flawless layer-to-layer alignment for 5G and high-density IC substrate fabrication, aligning with next-generation demands propelled by AI and advanced packaging markets.
Complementing Tongtai's mechanical prowess, Contrel Technology focused heavily on advanced laser processing and next-generation glass substrate applications, demonstrating its proprietary Through Glass Via (TGV) and Redistribution Layer (RDL) technologies within a comprehensive "Smart Manufacturing Solution." To accelerate the deployment of the global TGV Ecosystem, Contrel has seamlessly unified laser processing, physical vapor deposition (PVD), and electroplating workflows. Its flagship TGV system boasts an industry-leading throughput of 10,000 holes per second alongside a positioning accuracy of ±5 microns. Supporting a diverse array of glass panel dimensions, the system targets high-end packaging applications including advanced glass substrates, Fan-Out Panel-Level Packaging (FOPLP), and Micro LED encapsulation, establishing a critical foundation for semiconductor process integration.
Further strengthening the ecosystem, Contrel's strategic partner, Fullin Technology Co., Ltd., contributes advanced vacuum thin-film metallization (PVD) capabilities. This technology bridges seamlessly with Contrel's laser drilling process, yielding a highly unified workflow that spans glass drilling, thin-film metallization, and conductive layer formation. By securing the back-end process chain for glass substrates, this integration significantly bolsters total volume-production stability for global chipmakers and OSATs.
This joint exhibition underscores the powerful, complementary strengths of Tongtai and Contrel in the electronics and semiconductor equipment domains, marking a critical strategic evolution from traditional PCB machinery into next-generation glass substrate technologies. Moving forward, the companies will leverage their resilient financial foundations and joint technological innovations to drive product diversification and supply-chain integration, systematically elevating total process value and compounding long-term operational resilience.
