Tongtai and Contrel Debut Nano-Scale Ductile Grinding and Advanced Packaging Solutions at SEMICON Taiwan
TAIPEI, Taiwan, September 10, 2025 — As the global semiconductor industry enters rapid growth, advanced manufacturing and packaging technologies have become key drivers of industrial upgrading.
Tongtai (4526.TW), together with strategic partner Contrel Technology, participated in SEMICON Taiwan 2025, focusing on wafer processing and advanced packaging applications. Through its "dual-axis transformation" strategy, Tongtai demonstrated achievements in overseas market expansion and technological advancement.
At the exhibition, Tongtai showcased its Wafer Thinning Machine (TWG-1H0612) alongside a comprehensive lineup including the Multi-Station Grinding Machine (TWG-2H0612), Planarization Machine (TFC-1H0612), and the newly introduced Ductile Grinding Machine (TMP-2H12).
The Ductile Grinding Machine uses nano-scale material removal technology to significantly reduce damage layers from conventional grinding while integrating multiple grinding stages into a single process — an innovative approach for wafer thinning and pre-packaging processes.
The Planarization Machine has been successfully deployed in advanced packaging production lines with stable mass-production performance. Together, these solutions help customers improve yield rates, shorten process cycles, and reduce manufacturing costs.
Tongtai noted that silicon carbide (SiC) has become critical for high-power thermal management in AI server packaging, with applications expanding into GPU/memory stacking (CoWoS, HBM), high-performance data centers, AR smart glasses, and advanced 3D IC thermal substrates.
Contrel Technology focused on FOPLP packaging technologies, integrating laser processing and automation. FOPLP has entered mass production, with leading international manufacturers adopting this technology, demonstrating strong long-term market potential as a key advanced packaging solution for AI and high-performance computing.
By combining strengths in front-end wafer processing and back-end packaging, Tongtai and Contrel have established a complementary semiconductor equipment ecosystem, representing a long-term commitment to addressing global demand for high-precision and highly integrated manufacturing equipment.
Looking ahead, Tongtai will strengthen its front-end semiconductor process portfolio through core technologies such as wafer grinding and ductile machining while maintaining strategic collaboration with Contrel in FOPLP, aiming to help Taiwan's equipment industry play a more influential role in the global semiconductor supply chain.
