Tongtai Wafer Grinding Machine Receives Taiwan Excellence Award

Tongtai's TWG Wafer Grinding Machine has received the Taiwan Excellence Award. The TWG was developed to meet the stringent requirements for thickness uniformity (TTV) and warp control in advanced semiconductor packaging and wafer thinning processes.

Key technologies include:

• Self-developed hydrostatic spindle
• Self-developed control system
• Dual-spindle integration for coarse and fine grinding processes

The TWG Wafer Grinding Machine has successfully passed validation by leading international manufacturers. Moving forward, Tongtai will continue advancing equipment development and process applications in response to evolving industry demands.