Challenges in Advanced IC Substrate Routing
In advanced IC substrate routing, panel warpage and dimensional expansion or shrinkage are common challenges that can lead to reduced machining accuracy and lower yield. These issues often result in increased rework and manual intervention, ultimately impacting overall production efficiency.
To address these challenges, Tongtai developed the TCRM Series PCB routing machines with independent axis compensation. The system features independent X, Y, and Z-axis control combined with high-resolution CCD vision modules to detect and compensate for panel displacement and deformation in real time—ensuring machining accuracy and dimensional stability.
Each axis is equipped with a precision depth control system, achieving ±0.03 mm accuracy to further improve product consistency and yield. To reduce labor dependency and minimize panel variation caused by manual handling, Tongtai has collaborated with Contrel Technology Co., Ltd. to develop a highly integrated automation solution.
The system includes:
- Automatic loading and unloading
- Rapid positioning and compensation
- Tool life management
- In-line inspection
- Edge material recycling and cleaning
This solution significantly improves production efficiency and machine utilization while reducing operational risk and labor costs.
