IMTS 2026 | Hard & Brittle Material Solutions
From semiconductor components to precision optics, machining yield for hard and brittle materials often depends on how effectively the process can reduce cutting forces, minimize residual stress, and mitigate chipping and cracking.
At IMTS 2026, Tongtai will showcase the capabilities of the VU-5 Ultrasonic-Assisted Machining Center at the Taiwan Excellence Pavilion.
Visitors will have the opportunity to see actual Showerhead and Collimator components machined on the VU-5. Featuring micro-holes, deep cavities, and honeycomb structures, these samples demonstrate how ultrasonic-assisted machining can maintain machining accuracy and process stability while achieving high-quality cutting under reduced cutting forces.
We invite you to visit our booth, meet with the Tongtai technical team, and explore new possibilities for high-precision machining of hard and brittle materials.
Exhibition Information
• Dates: September 14–19, 2026
• Venue: McCormick Place, North Hall, Chicago
• Booth: Taiwan Excellence Pavilion, Booth No. 236834
Tech Talk
• Topic: Applications of Ultrasonic-Assisted Machining in the Semiconductor Industry
• Date & Time: September 16, 12:00–1:00 PM
• Venue: Taiwan Excellence Pavilion, Booth No. 236834
