Tongtai Integrates Wafer Processing and Component Machining at SEMICON Taiwan 2026
Tongtai Machine & Tool Co., Ltd. (TWSE: 4526) is bringing together its Electronics Equipment Business and Machine Tool Business for the first time at SEMICON Taiwan 2026, showcasing wafer grinding and advanced packaging planarization equipment alongside high-precision machining technologies for critical semiconductor equipment components. This marks the first time in the Group's history that the two business divisions have jointly exhibited at a semiconductor industry event on this scale.
The integrated presence of the two businesses demonstrates Tongtai's dual-core strategy for addressing semiconductor manufacturing requirements across both process equipment and precision component production.
The Electronics Equipment Business focuses on wafer processing and advanced packaging, presenting core technologies including wafer thinning, ductile-mode grinding, and planarization. These solutions are designed to meet the high-precision processing requirements of next-generation wafer materials such as silicon (Si) and silicon carbide (SiC), as well as composite materials used in advanced packaging, helping customers improve machining quality, yield, and process stability.
The Machine Tool Business, meanwhile, focuses on the semiconductor equipment manufacturing supply chain. By integrating ultrasonic machining, high-precision cutting, and a broad range of machining capabilities, Tongtai provides turnkey services for equipment structural components and advanced consumable parts made from high-performance materials such as metals and ceramics. Its services cover process development, machining validation, and mass-production implementation, helping customers shorten new-product development cycles and accelerate supply-chain localization and production ramp-up.
The joint exhibition also marks Tongtai's formal positioning of the semiconductor equipment market as one of the Group's core growth pillars, while reinforcing its new role as a “process-centric system integration solution provider.”
“The increasing precision of semiconductor processes and the localization of supply chains are long-term and irreversible trends. Tongtai's decades of expertise in precision manufacturing provide the strongest foundation for our expansion into the semiconductor equipment market,” said Yen Jui-Hsiung, Chairman of Tongtai Machine & Tool.
“By integrating our Electronics Equipment and Machine Tool businesses, we aim to enable customers to address two critical requirements within a single partnership framework: the adoption of advanced process equipment, and the manufacturing technologies and machine tools required to produce precision modules and components for semiconductor equipment. This is the core value Tongtai delivers as a system integration solution provider.”
Wafer and Advanced Packaging Planarization
For wafer and packaging planarization applications, Tongtai's Electronics Equipment Business is showcasing processing solutions and sample workpieces involving wafer grinding, planarization, and ductile-mode grinding.
Its surface grinding and composite-material planarization technologies have already been applied to advanced packaging processes for the planarization of heterogeneous and composite material structures. Tongtai's ductile-mode grinding technology is designed for hard and brittle materials such as silicon wafers and silicon carbide. Through nanoscale material removal, the process minimizes machining-induced damage and can effectively reduce the number of steps required in conventional manufacturing processes.
Precision Machining of Critical Semiconductor Equipment Components
For critical semiconductor equipment components, Tongtai's Machine Tool Business integrates high-precision turning, milling, and ultrasonic machining capabilities, targeting key components commonly used in semiconductor manufacturing equipment, including vacuum and gas-control components, handling and carrier components, and reaction chamber components.
For metals and difficult-to-machine hard and brittle materials commonly found in semiconductor equipment—including precision alloys, engineering ceramics, quartz, and silicon carbide—Tongtai provides a one-stop turnkey solution covering material-property analysis, process development, machining validation, and equipment implementation for mass production.
Through these capabilities, Tongtai helps semiconductor equipment suppliers overcome machining barriers, shorten development cycles, and accelerate the localization and production implementation of critical components.
Laser Processing for Advanced Packaging
Tongtai's laser processing equipment has already been introduced into high-end advanced packaging production lines.
Designed for multilayer composite material structures, Tongtai's laser solutions feature a low heat-affected zone (HAZ), enabling precision microvia formation and window-opening processes without damaging adjacent materials. These capabilities address the stringent positioning accuracy and thermal-control requirements of high-density advanced packaging applications.
Looking ahead, Tongtai will continue to deepen its technology portfolio in wafer grinding, ductile-mode machining, and laser window-opening processes, while further expanding the Machine Tool Business's capabilities in semiconductor critical-component machining equipment and manufacturing technology solutions.
Through the integration of process equipment, machining technologies, and system engineering expertise, Tongtai aims to address the semiconductor and advanced packaging industries’ long-term demand for precision process equipment as well as advanced machining technologies and solutions for critical components.
