SEMICON Taiwan: Advanced Packaging FOPLP Process Solutions
For advanced packaging FOPLP processes, Tongtai provides:
✅Grinding Solutions: For EMC and substrate thinning applications
✅Planarization Solutions: Ensuring surface flatness to improve downstream process precision
In addition, through collaboration with affiliated partners Contrel Technology Co., Ltd. and Fullin Technology Co., Ltd., Tongtai is able to provide more comprehensive solutions covering critical processes from front-end to back-end manufacturing stages.
SEMICON Taiwan 2025 is coming soon!
We sincerely invite you to visit our booth and connect with us in person to explore more possibilities together.
Date: September 10–12
Venue: Taipei Nangang Exhibition Center, Hall 1 | 1F
Booth: I2716
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