SEMICON Taiwan 2025 │ Wafer Thinning Machine

Get a first look at one of Tongtai's key highlights at SEMICON Taiwan 2025 !!!

TWG-1H0612 Wafer Thinning Machine

High-rigidity cast structure for stable machining performance
Hydrostatic spindle with a precision feed module for micron-level thickness control
Supports Si, SiC, and sapphire wafers for both coarse and fine grinding

We warmly invite you to visit SEMICON Taiwan and explore new solutions for wafer thinning and advanced packaging.

Date: September 10–12
Venue: Taipei Nangang Exhibition Center, Hall 1, 1F
Booth: I2716

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