Explore the Future at Touch Taiwan 2025!

Precision Grinding, Perfecting the Future — Discover More at Touch Taiwan 2025

In semiconductor and advanced packaging processes, surface flatness is key to ensuring high yield. Tongtai's self-developed wafer grinding and package planarization equipment combine a high-rigidity natural granite base, in-house air/hydrostatic spindles and rotary tables, and direct-drive technology to deliver exceptional precision and stability.

Touch Taiwan 2025 Information

Date: April 16–18, 2025
Venue: Taipei Nangang Exhibition Center, Hall 1
Booth: M210

We warmly invite you to visit our booth and discover how Tongtai helps overcome challenges in wafer thinning and package planarization, enhancing both yield and production efficiency.

touch-taiwan-2025

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